|
|
|||||||||||||||||
詳細(xì)介紹
尺寸
| 長度(L) | 2.00mm ±0.20mm |
| 寬度(W) | 1.25mm ±0.20mm |
| 厚度(T) | 1.25mm ±0.20mm |
| 端子寬度(B) | 0.20mm Min. |
| 端子間隔(G) | 0.50mm Min. |
| 推薦焊盤布局(PA) |
1.00mm to 1.30mm(Flow Soldering) 0.90mm to 1.20mm(Reflow Soldering) |
| 推薦焊盤布局(PB) |
1.00mm to 1.20mm(Flow Soldering) 0.70mm to 0.90mm(Reflow Soldering) |
| 推薦焊盤布局(PC) |
0.80mm to 1.10mm(Flow Soldering) 0.90mm to 1.20mm(Reflow Soldering) |
電氣特性
| 電容 | 47μF ±20% |
| 額定電壓 | 10VDC |
| 溫度特性 ? | X5R(±15%) |
| 耗散因數(shù) (Max.) | 10% |
| 絕緣電阻 (Min.) | 2MΩ |
其他
| 溫度范圍 | -55～85°C |
| 焊接方法 | 流體回流 |
| AEC-Q200 | NO |
| 包裝形式 | 塑封編帶 (180mm卷筒) |
| 包裝個(gè)數(shù) | 2000pcs |
聯(lián)系方式
|
